| ‘? Mss1P2L, MSS1P3L7 www'ViShay'C°m Vishay General Semiconductor 1000 1000 ‘Junction 10 Ambient g10 1 A 5)) 5 8§ § 100 E 3 .6 E (§ 100 E _§ E 10 g 5:‘ I E B III||_ |||_IIlIII|| Q (0 I|||||I II|||||IIII||||| 5 0.1 1 10 100 0.01 Reverse Voltage (V) t- Pulse Duration (S) Fig. 5 - Typical Junction Capacitance Fig. 6 - Typical Transient Thermal Impedance PACKAGE OUTLINE DIMENSIONS in inches (miiiimeters) MicroSMP 0.059 (1.50) 0.030 (0.75)Cathode Band 0043 (1.10) T i‘ 0.022 (0.55) 0.055 (1.40) __ 0.039 (0.93) _ _ 0.030 (0.75) 0.047 (1.20) 0.031 (0.78) 0.022 (0.55)0.091 (2.30) 0.003 (2.10) 0.106 (2.70) 0.091 (2.30) Mounting Pad Layout 0.079 T} (2.00) ? rm?.‘ 0.029 (0.73) 0.025 (0.63) J F 0.011 (0.27)T 0-005 (0.12) 0.020 (0.50) l-—.l Revision: 25-Jul-13 3 Document Number: 89020 For technical questions within your region: Diog§sArnericas@vishay.corn, DiogesAsia@vishay.com, DigdesEurope@Vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT To SPECIFIC DISCLAIMERS, SET FORTH AT www.vishg1.0omzd9o?9100!! |